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Calterah Reflects on Its Journey of Standardizing Automotive Chip Software at China Automotive Chip Summit 2024

2024-06-19

On June 18, 2024, the inaugural China (Chongqing) Intelligent Automotive Basic Software Ecosystem Conference and the third China Automotive Chip Summit were held. Focusing on topics such as automotive chips and software-hardware integration, the summit aims to explore the development of intelligent automotive chip software. Calterah, as a leading automotive mmWave radar chip enterprise, was invited to the summit to deliver a keynote speech on the exploration and practice in automotive chip software standardization. Calterah also showcased its latest Andes SoC 2-chip cascaded imaging radar solution at the main forum and signed a strategic cooperation agreement with iSoft Infrastructure Software Co., Ltd.

In the speech "Journey of Automotive Chip Software Standardization: Exploration and Practice", Calterah's Director of Firmware, Minnan Zheng, reviewed the key achievements and development stages of Calterah chip software standardization. The journey of standardization for Calterah went through five stages, from initial exploration to comprehensive evaluation, from deep implementation to standard formulation, and finally to standard solidification. Each stage has marked a solid step forward on Calterah’s path to standardization.

Throughout the entire process, Calterah has overcome various obstacles and challenges in areas such as bidirectional traceability, writing reasonable requirements, efficient and high-quality delivery, aligning testing environment, standard fusion and domain fusion. Standard fusion and domain fusion are two major challenges: integrating multiple standards such as functional safety, information security, and ASPICE, while achieving unity and integration in multiple domains of chip development, including software, hardware, digital design, analog design, and antenna design.

Calterah V Model for Automotive Chip Development

Regarding the strategy of both standard fusion and domain fusion, "We integrate all elements into the V model of ASPICE. During the actual operation of development and testing, every requirement has descriptions of functional safety and information security, and the requirements of functional safety and information security are integrated into our testing and design methods," Minnan Zheng explained. By closely combining research and development with testing, Calterah has also securely integrated its key technologies, such as secure boot, secure storage, secure communication, secure access, and secure upgrade. In terms of innovative tools and advanced solutions, Calterah has deployed PDCA management tools, CI/CD, cloud testing, and SecDevOps system, etc., effectively addressing many challenges and significantly improving software development quality and efficiency.

A decade on, Calterah has remained steadfast to the commitment of standardizing automotive chip development, continuously improving its chip development system. This dedication has earned the company a number of international recognitions, including international certifactions of ISO 9001:2015 Quality Management, ISO 26262:2018 Functional Safety Management, ISO/SAE 21434:2021 Cybersecurity Management, ASPICE Capability Level 2, ISO/IEC 27001:2013 Information Security Management. Calterah is also actively progressing towards TISAX certification. Currently, Calterah's AUTOSAR SDK software development mode strictly complies with various automotive grade standards. It has realized platformization, automation, and security, laying a solid foundation for continuous innovation and improvement of product quality.

Calterah's Achievements and Milestones of Chip Standardization

Looking ahead, Calterah will continue exploring the innovative applications of emerging technologies, such as AI, in chip software standardization. With such efforts, Calterah strives to boost technological progress and market competitiveness in the automotive chip industry, contribute to the standardization of automotive chip software, and drive chip innovations that propel the development of intelligent vehicles.