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Calterah Strengthens European Presence with New Munich Office
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Calterah Becomes One of the Very Few Globally and First in China to Achieve FiRa® Core 3.0 Certification for Dubhe UWB Chips
From mmWave Sensing to UWB Connectivity, Calterah Embarks on a New Journey for Future Mobility
Auto Shanghai 2025: Multiple Popular Car Models with Calterah Radar Chips Inside for Safer and More Reliable ADAS
Elevating Information Security for Sustainable Development: Calterah Achieves Highest Assessment Level (AL3) of TISAX®
Calterah Obtains TMMi Level 4 Certification, Scoring “Fully Achieved” in All Process Areas
electronica 2022: Productive and Inspirational for Calterah
2022-12-01
Calterah’s DDM-MIMO Facilitates Mass Production of High-Performance Corner Radar
2022-09-30
Calterah Holds Its First Industrial Tech Day
2022-09-05
China College IC Competition Summit: CMOS and AiP Pave the Way for Wide Adoption of mmWave Radar
2022-07-25
Calterah Delivers IWPC Keynote Speech to Introduce the Technology and Emerging Applications of Antenna in Package (AiP)
2022-02-25
Calterah Receives 2021 Lingxuan Award for Excellent Mass-Produced ICs
2021-12-06
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